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| RF6100-4 3V 1900MHZ LINEAR POWER AMPLIFIER MODULE RoHS Compliant & Pb-Free Product Package Style: Module (4mmx4mm) Features Input/Output Internally Matched@50 28.5dBm Linear Output Power 39% Peak Linear Efficiency 28dB Linear Gain -48dBc ACPR @ 1.25MHz VCC1 1 RF IN 2 GND 3 VMOD 4 E VREG 5 Bias 10 VCC2 9 GND 8 RF OUT 7 GND 6 GND Applications 3V CDMA US-PCS Handset 3V CDMA2000/1XRTT USPCS Handset 3V CDMA2000/1X-EV-DO USPCS Handset Spread-Spectrum System Functional Block Diagram Product Description The RF6100-4 is a high-power, high-efficiency linear amplifier module specifically designed for 3V handheld systems. The device is manufactured on an advanced third generation GaAs HBT process, and was designed for use as the final RF amplifier in 3V IS-95/CDMA 2000 1X handheld digital cellular equipment, spread-spectrum systems, and other applications in the 1850MHz to 1910MHz band. The RF6100-4 has a digital control line for low power applications to lower quiescent current. The device is self-contained with 50 input and output that is matched to obtain optimum power, efficiency and linearity. The module is a 4mmx4mm land grid array with backside ground. The RF6100-4 is footprint compatible with industry standard 4mmx4mm CDMA modules, and requires only one decoupling capacitor. Ordering Information RF6100-4 3V 1900MHz Linear Power Amplifier Module RF6100-4PCBA-41X Fully Assembled Evaluation Board Optimum Technology Matching(R) Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, PowerStar(R), POLARISTM TOTAL RADIOTM and UltimateBlueTM are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. (c)2006, RF Micro Devices, Inc. Rev A1 DS050929 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 1 of 8 RF6100-4 Absolute Maximum Ratings Parameter Supply Voltage (RF off) Supply Voltage (POUT 31dBm) Control Voltage (VREG) Input RF Power Mode Voltage (VMODE) Operating Temperature Storage Temperature Rating +8.0 +5.2 +3.9 +10 +3.5 -30 to +110 -40 to +150 Unit V V V dBm V C C Caution! ESD sensitive device. Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Parameter High Gain Mode (VMODE Low) Operating Frequency Range Linear Gain Second Harmonics Third Harmonics Maximum Linear Output Linear Efficiency Maximum ICC ACPR @ 1.25MHz ACPR @ 2.25MHz Input VSWR Output VSWR Stability Noise Power Min. Specification Typ. Max. Unit Condition T=25oC Ambient, VCC =3.4V, VREG =2.8V, VMODE =0V, and POUT =28.5dBm for all parameters (unless otherwise specified). 1850 26 28 -35 -40 28.5 35 39 535 -48 -62 2:1 1910 31 -30 MHz dB dBc dBc dBm % 600 -46 -56 6:1 10:1 mA dBc dBc No oscillation>-70dBc No damage dBm/Hz At 80MHz offset. T=25oC Ambient, VCC =3.4V, VREG =2.8V, VMODE =2.8V, and POUT =28.5dBm for all parameters (unless otherwise specified). -139 Low Gain Mode (VMODE High) Operating Frequency Range Linear Gain Second Harmonics Third Harmonics Maximum Linear Output Linear Efficiency ACPR @1.25MHz ACPR @2.25MHz Maximum ICC Linear Gain Input VSWR Output VSWR Stability 28.5 35 39 -48 -60 140 26 2:1 6:1 10:1 -46 -56 165 1850 25 27 -35 -40 1910 31 -30 MHz dB dBc dBc dBm % dBc dBc mA dB POUT =16dBm POUT =16dBm No oscillation>-70dBc No damage 2 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A1 DS050929 RF6100-4 Parameter Power Supply Supply Voltage High Gain Idle Current Low Gain Idle Current VREG Current VMODE Current RF Turn On/Off Time DC Turn On/Off Time Total Current (Power Down) VREG Low Voltage (Power Down) VREG High Voltage (Recommended) VREG High Voltage (Operational) VMODE Voltage VMODE Voltage 0 2.75 2.7 0 2.0 2.8 3.2 60 50 3.4 75 65 1.1 250 1.2 2 0.2 4.2 90 80 2 500 6 40 5 0.5 2.95 3.0 0.5 3.0 V mA mA mA uA uS uS uA V V V V V High Gain Mode Low Gain Mode VMODE =low and VREG =2.8V VMODE =high and VREG =2.8V VCC =3.4V, VREG =2.8V Min. Specification Typ. Max. Unit Condition T=25C Ambient Rev A1 DS050929 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 3 of 8 RF6100-4 Pin 1 2 3 4 5 6 7 8 9 10 Pkg Base Function VCC1 RF IN GND VMODE VREG GND GND RF OUT GND VCC2 GND Description First stage collector supply. A low frequency decoupling capacitor (e.g., 4.7F) may be required. RF input internally matched to 50. This input is internally AC-coupled. Ground connection. Connect to package base ground. For best performance, keep traces physically short and connect immediately to ground plane. For nominal operation (High Power Mode), VMODE is set LOW. When set HIGH, devices are biased lower to improve efficiency. Regulated voltage supply for amplifier bias. In Power Down mode, both VREG and VMODE need to be LOW (<0.5V). Ground connection. Connect to package base ground. For best performance, keep traces physically short and connect immediately to ground plane. Ground connection. Connect to package base ground. For best performance, keep traces physically short and connect immediately to ground plane. RF Output internally matched to 50. This output is internally AC-coupled. Ground connection. Connect to package base ground. For best performance, keep traces physically short and connect immediately to ground plane. Output stage collector supply. A low frequency decoupling capacitor (e.g., 4.7F) is required. Ground connection. The backside of the package should be soldered to a top side ground pad which is connected to the ground plane with multiple vias. The pad should have a short thermal path to the ground plane. Interface Schematic Package Drawing 1 1.40 1.25 4.00 0.10 Dimensions in mm. 4.00 0.10 Shaded areas represent pin 1 location. 0.450 0.075 0.100 TYP 0.500 0.550 TYP 0.806 3.200 3.350 3.500 TYP 3.900 TYP 1 3.903 TYP 3.453 TYP 3.053 2.653 2.205 TYP 1.805 TYP 1.475 TYP 1.455 0.155 0.103 TYP 0.000 3.850 3.050 2.825 2.600 2.418 2.053 1.953 1.353 0.953 0.553 0.155 0.000 0.600 0.800 1.000 TYP 3.000 4 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A1 DS050929 RF6100-4 Evaluation Board Schematic VCC1 C2 4.7 F 50 strip 1 2 3 4 C4 4.7 F 5 P1 1 VREG C3 4.7 F P1-2 2 3 P1-4 4 P2 1 2 P2-3 3 4 P2-5 Bias 10 9 8 7 6 C1 22 F 50 strip J2 RF OUT VCC2 J1 RF IN VMODE GND VCC1 GND VCC2 GND GND VRE G GND GND 5 CON5 VMODE 5 CON5 Rev A1 DS050929 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 5 of 8 RF6100-4 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land and Solder Mask Pattern A = 0.40 (mm) Sq. Typ. 3.40 Typ. 2.55 Typ. 1.90 Typ. 1.50 Typ. 0.85 Typ. 0.00 A A Pin 1 A A A 3.60 Typ. 2.75 Typ. 2.35 Typ. Pin 1 A = 0.55 (mm) Sq. Typ. B = 2.65 x 3.95 (mm) A A A A A B A A A A A 3.40 Typ. 2.55 Typ. Dimensions in mm. 1.70 Typ. 0.85 Typ. 0.00 A 1.70 Typ. 1.05 Typ. 0.65 Typ. 0.20 Typ. 0.20 Typ. 0.00 2.95 Typ. 0.45 Typ. 3.60 Typ. Metal Land Pattern Figure 1. PCB Metal Land Pattern and Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. 6 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 0.00 Solder Mask Pattern Rev A1 DS050929 1.70 RF6100-4 Rev A1 DS050929 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. 7 of 8 RF6100-4 8 of 8 7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Rev A1 DS050929 |
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